Study of mutual coupling on mobile phone PCB with shielding using FDTD

For the real-world usage, generally a PCB-level EMC problem is massive and complicated. It is common that EMC engineers design the PCB by following the design guidelines with practical experience [1] and confirm the performance with measurement directly. In order to obtain more insight of the EMC behavior, the problems are usually simulated with simplified models in numerical way. Regarding to the numerical simulation, in addition to other methods, there are many studies in this topic investigated with Finite-Difference Time-Domain (FDTD) for obtaining the time-domain information and EM field distributions [2]. Besides, FDTD also performs very well in simulating highly inhomogeneous environment, like a real PCB. Thanks to the big advance of integrated circuits technology and hardware acceleration (Acceleware), FDTD is used to simulate a real mobile phone PCB in this study (SEMCAD X). This is helpful to have more understanding to the problems in the real-world scenarios.