Photosensitive composition, a photosensitive film, a permanent pattern forming method, and a printed circuit board

PROBLEM TO BE SOLVED: To provide a photosensitive composition for a solder resist having high sensitivity, high resolution, good storage stability and good various properties required and capable of forming a high-definition permanent pattern, by use of a photopolymerization initiation type compound containing a dithiolidene ketone sensitizing dye, and to provide a photosensitive film, a permanent pattern forming method using the photosensitive composition, and a printed circuit board on which a pattern is formed by the permanent pattern forming method. SOLUTION: The photosensitive composition contains a binder, a polymerizable compound, the photopolymerization initiation type compound and a heat crosslinking agent, wherein the photopolymerization initiation type compound contains (A) a compound which is a neutral 2-(1,3-dithioliden-2-yl)-1,3-dihydro-1-oxo-2H-indene derivative and is represented by general formula (I) and (B) a neutral o-acyloxime compound represented by any of general formulae (II-1) to (II-4). COPYRIGHT: (C)2008,JPO&INPIT