And a power module packaging method

The invention provides a power module and a packaging method thereof. The power module comprises a lead frame, a PCB and a chip; the PCB is connected to and communicated with the lead frame; an electrode on the first side surface of the chip is welded on the chip bonding pad of the PCB; the power module further comprises an aluminum-based printed circuit; an electrode on the second side surface, opposite to the first side surface, of the chip is welded on the chip bonding pad of the aluminum-based printed circuit; the aluminum-based printed circuit is connected to and communicated with the lead frame. The power module is used for solving the problem of high cost of the power module which is manufactured by use of noble metals in the prior art.