Old Web
English
Sign In
Acemap
>
Paper
>
Adhesion Enhancement between Ti Films and Si Substrates by Low Power Ar Ion Bombardment
Adhesion Enhancement between Ti Films and Si Substrates by Low Power Ar Ion Bombardment
1996
Ichiharu Kondo
Kenji Kondo
Osamu Takenaka
Masahiko Nagata
Eiji Kusano
Akira Kinbara
Keywords:
Metallurgy
Thin film
Inorganic chemistry
Titanium
Ion
Materials science
Adhesion
Silicon
ion bombardment
Correction
Source
Cite
Save
Machine Reading By IdeaReader
1
References
0
Citations
NaN
KQI
[]