About using combined stresses for reliability testing of microsystems
2009
Reliability testing of microsystems could be performed on combined stress facilities. There are two reasons for using combined stresses when effective accelerated tests are needed: i) better simulation of the operational environment and ii) the synergy of the environmental factors is significantly shortening the test duration. Five examples of using combined stress in microsystem reliability tests are shown for the testing facilities that are located at IMT-Bucharest.
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
3
References
0
Citations
NaN
KQI