Impact of Terrestrial Neutrons on the Reliability of SiC VD-MOSFET Technologies

Accelerated terrestrial neutron irradiations were performed on different commercial SiC power MOSFETs with planar, trench, and double-trench architectures. The results were used to calculate the failure cross sections and the failure-in-time (FIT) rates at sea level. Enhanced gate and drain leakage were observed in some devices which did not exhibit a destructive failure during the exposure. In particular, a different mechanism was observed for planar and trench gate MOSFETs, the first showing a partial gate rupture with a leakage path mostly between the drain and the gate, similar to what was previously observed with heavy ions, while the second exhibiting a complete gate rupture. The observed failure mechanisms and the postirradiation gate stress (PIGS) tests are discussed for different technologies.