Curing Behavior of Siloxane-Containing Epoxy

The curing processes of a novelly synthesized siloxane-containing epoxy resin (SE) and bisphenol A diglycidyl ether (CYD-128) were investigated using dynamic differential scanning calorimetry (DSC), and analyzed by three different methods. The results show that while SE has a lower initial curing temperature and a smaller pre-exponential factor than CYD-128, their curing processes belong to first order kinetic reaction. All the three dynamic methods verified mutually reveal that SE with more catalytic hydroxyls possesses lower activation energy and exhibits a stronger curing reactivity than CYD-128.