Flexible Dielectric Bi1.5Zn1.0Nb1.5O7 Thin Films on a Cu‐Polyimide Foil

Flexible thin films of Bi 1.5 Zn 1.0 Nb 1.5 O 7 (BZN) were deposited on a Cu/polyimide (PI) foil by aerosol deposition at room temperature. The BZN film thickness was in the range of 1.2-17.9 μm. Highly dense and nanocrystalline films were obtained without any heat treatment. The dielectric constant and loss of the film at 100 kHz were over 150 and 0.04, respectively. Furthermore, the as-deposited film showed markedly low leakage current densities of <10 -9 A/cm 2 at 3.0 V. These reasonably high dielectric properties were due to the nanocrystallinity of the films. The results confirm the significant potential of the BZN films as passive components in flexible printed circuit board applications.