Hybrid bonding and hybrid actuator engagement device

The present invention discloses a device and performing hybrid hybrid bonding engagement, wherein performing a method comprising mixing a first package component to engage with the second engagement element package, so as to form a bonded pair. In the bonding of the first metal pad of the first package component in the second package member engaging a second metal pad, and the first surface of the dielectric layer at the surface of the first package and the second package member a second surface dielectric layer at the surface of the engaging member. After mixing engagement, the engagement of performing compression heat annealing.