Laser Formation of Holes in Nonmetallic Substrates

The use of a pulse picosecond laser with a wavelength of 532 nm and frequency of 15 Hz in the formation of holes with diameters up to 0.1 mm in nonmetallic substrates (silicon, ceramics, etc.) was proposed. It was found by modeling in MathCAD and COMSOL Multiphysics that the half-angle value of the light cone aperture that depends on the focusing of laser radiation exerts a significant effect on the depth and diameter of holes in laser processing. The influence of the regimes of laser processing employing nanosecond and picosecond lasers with wavelengths of 1064 and 532 nm, respectively, on the conicity and time of formation of holes in silicon substrates was investigated. The preliminary heating of the substrate to 170–200°С reduces the time of formation of the holes by 20%.