Capacitive micro-electro-mechanical device and method for forming a capacitive micro-electro-mechanical device

A schematic illustration of a capacitive micro-electromechanical device 2 is shown. The capacitive micro-electromechanical device 2 includes a semiconductor substrate 4, a support structure 6, an electrode member 8, a spring element 10 and a seismic mass 12. The support structure 6, for example a rod, a suspension or a post is firmly connected to the semiconductor substrate 4 may comprise silicon. The electrode element 8 is fixedly connected to the support structure. 6 Furthermore, the seismic mass 12 is connected via the spring member 10 to the support structure 6, so that the seismic mass 12 displaceable with respect to the electrode member 8, deflectable or movable. Furthermore, the seismic mass and the electrode member forming from a capacitor having a capacitance which is dependent on a displacement between the seismic mass and the electrode member.