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Electroless Bismuth Plating as a Peripheral Technology for SiC Power Devices
Electroless Bismuth Plating as a Peripheral Technology for SiC Power Devices
2014
Ei Uchida
Kaoru Tanaka
Miri Okada
Takaaki Tsuruoka
Kensuke Akamatsu
Hidemi Nawafune
Keywords:
Power semiconductor device
Bismuth
Metallurgy
Materials science
Gold plating
Mixed potential theory
Correction
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