Electronic packaging and passive devices for low temperature space applications

In addition to the challenges of cold operation for active devices, passive devices and packaging materials exhibit changes in electrical behavior as a function of temperature. Results on the temperature dependent behavior of capacitors and substrate materials as a function of temperature and frequency to −185°C will be discussed. These properties may further change if the materials exhibit degradation due to mechanical loading. Whether the electronics are intended to operate at cold temperatures or simply survive exposure to cold temperatures, the packaging technologies between the electronics and the outside world are required to survive multiple extreme low temperature cycles, which combine the challenges of cold temperature exposure and fatigue at low temperatures. To that end, the impact of extreme low temperatures on the mechanical behavior of various key electronic packaging materials will be discussed along with experimental results obtained from several representative assemblies that have been thermally cycled or shock cycled down to −120°C or lower.