The adhesive sheet and a semiconductor device and manufacturing method thereof

PROBLEM TO BE SOLVED: To provide an adhesive sheet which acts as a dicing tape in a dicing step and exhibits an excellent joint reliability in a step for joining a semiconductor element to a support member, which has resistances to heat and moisture required in mounting, on the support member for mounting the semiconductor element, a semiconductor element having a thermal expansion coefficient largely different from that of the support member, and which is excellent in workability; and a production method whereby the production process of a semiconductor device can be simplified. SOLUTION: The adhesive sheet is radiation-polymerizable and thermally polymerizable and is composed of (1) a hardenable pressure-sensitive adhesive layer containing (A) an epoxy resin and an epoxy resin curing agent, (B) a high-mol.wt. component containing functional monomer units and having a wt. average mol.wt. of 100,000 or higher, and (C) a compound generating a base by the exposure to a radiation, (2) an adhesive layer containing (A) an epoxy resin and an epoxy resin curing agent and (B) a high-mol.wt. component containing functional monomer units and having a wt. average mol.wt. of 100,000 or higher, and (3) a substrate. COPYRIGHT: (C)2004,JPO