How to Cmp composition and using the same, a method of manufacturing a semiconductor device

To provide a chemical mechanical polishing (CMP) composition comprising an aromatic compound containing a non-ionic surfactant and at least one acid group. A chemical mechanical polishing (CMP) compositions of the present invention (Q) is, (A) is a cocoon-shaped particles, and inorganic particles, organic particles or a mixture or composite thereof, (B) a non-ionic surfactant and active agent, and an aromatic compound or a salt containing (C) at least one acid group (Y), and a (M) aqueous medium.