De-soldering method for elements with bottom terminal packaging

The invention discloses a de-soldering method for elements with bottom terminal packaging and aims at providing a de-soldering method which is short in operation time and capable of not burning elements and printed boards. According to the technical scheme, a silver plated copper wire with the diameter phi in a range of 0.08mm to 0.12mm is used for winding the element body (1) and printed circuit board (6) joint portion for two circles, and the length of the silver plated copper wire is that the silver plated copper wire can wind the element body for at least two circles. The silver plated copper wire is attached to the soldering disc exposure portions of the element body (1) and printed circuit board soldering pad (7) bottom soldering point connection positions and exposed terminal side portions (3) of bottom terminals (4) of the element body (1) to wound all soldering points; the exposed silver plated copper wire is heated directly through electric soldering iron, a certain amount of soldering flux is added at the position of a soldering tip while the silver plated copper wire is heated, heat is transmitted to the bottom terminals and the printed circuit board soldering disc through the silver plated copper wire and the exposed fused soldering flux directly, and all heat is concentrated to the soldering points rapidly, accordingly, the apparatus is taken down.