Wafer level encapsulation techniques for a MEMS microreactor with integrated heat exchanger

This paper presents a MEMS chemical microreactor with integrated heat exchanger designed and fabricated by means of wafer level encapsulation techniques like low temperature (400°C) silicon fusion bonding and thin film encapsulation. The fabrication method results in a leak tight reaction cavity under 1 atm pressure difference during operation. Furthermore, the surface micromachining process leads to scale down the height of the microchannels and to achieve close contact between hot and cold microchannels along their whole length, maximizing heat exchanging capability of the device.