Dynamic image acquisition and verification for a 32-stages time delay and integration CMOS image sensor

For the earth observation mission, there are some critical environmental requirements including low-light condition, fast moving objects, high scanning rate. In order to meet these requirements, the Time-Delay-and-Integration (TDI) technique is critical and essential for the sensor part to improve the Signal to Noise Ratio (SNR) performance. National space organization (NSPO) collaborates with National Chip Implementation Center (CIC) on the next generation image sensor. In order to increase SNR under the light-starved condition, a 32-stages digital-accumulator Time-Delay-and-Integration (TDI) CMOS image sensor is adapted to improve the image quality. Besides, it could successfully take several pictures under different TDI stages on a dynamic test bench. The experimental results verified that the 32-stage TDI CMOS image sensor could function well.