Tin or tin alloy plating bath, electric and electronic components fabricated by using the tin salt of construction bath or for maintenance and replenishment of the plating bath and an acid or complexing agent solution and the plating bath

PROBLEM TO BE SOLVED: To provide a tin or tin-based alloy plating bath having greatly improved soldering properties, a tin salt and an acid or complexing agent solution for building bath or for maintaining and replenishing the plating bath, and the plating bath. Provide electrical and electronic components manufactured using The plating bath is a tin plating bath or a tin-based alloy plating of tin and one or more metals selected from the group consisting of copper, zinc, silver, indium, gold and bismuth. A bath comprising at least the following components (A) to (D): (A) 5 g / L or more and 200 g / L or less of divalent tin ions, and (B) a stoichiometric equivalent or more of divalent tin ions and water solubility with respect to divalent tin ions. One or more acids or complexing agents which form a salt or complex of (C), from 20 ppm to 2000 ppm in total with respect to tin (C), IB to VB groups in the 4th to 6th periods of the periodic table One or more metals selected from the group consisting of tin, mercury, thallium and elements other than those contained in the group (I), (D) It is characterized by containing one or more of antioxidants as an essential component in a total of 1 mg / L to 10 g / L.