Constructing two-scale network microstructure with nano-Ti5Si3 for superhigh creep resistance

Abstract The improvement of mechanical properties must be achieved by designing and constructing more suitable microstructure, such as hierarchical microstructure. In order to significantly enhance the creep resistance of titanium matrix composites (TMCs), two-scale network microstructure was constructed including the first-scale network ( 5 Si 3 reinforcement by powder metallurgy and in-situ synthesis. The results showed that the creep rate of the composite was remarkably reduced by an order of magnitude compared with the Ti6Al4V alloy at 550 °C, 600 °C, 650 °C under the stresses between 100 MPa and 350 MPa. Moreover, the rupture time of the composite was increased by 20 times, compared with that of the Ti6Al4V alloy at 550 °C/300 MPa. The superior creep resistance could be attributed to the hierarchical microstructure. The micro-TiBw reinforcement in the first-scale network boundary contributed to creep resistance primarily by blocking grain boundary sliding, while the nano-Ti 5 Si 3 particle in the second-scale network boundary mainly by hindering phase boundary sliding. In addition, the nano-Ti 5 Si 3 particle was dissolved, and precipitated with smaller size than the primary Ti 5 Si 3 . This phenomenon was attributed to Si element diffusion under high temperature and external stress, which could further continuously enhance the creep resistance. Finally, the creep rate during steady-state stage was significantly decreased, which manifested superior creep resistance of the composite.