Optimized circuit design and novel Al deposition process cure power short failure caused by Al whisker

Power short (PS) bin failure due to Al bridging in bond pad regions originated from Al whisker, caused severe yield loss in advanced technology nodes. A comprehensive study on circuit design impact on Al whisker bridging issue was carried out and it was found that increasing Al metal spacing reduced Al whisker bridging. Furthermore, through optimization of process, the novel Al high power deposition recipe demonstrated that power short failure caused by Al whisker could be completely eliminated. The two proposed solutions provide a guideline to solve Al whisker for more advanced technology nodes.