Fabrication of a metallic roll stamp with low internal stress and high hardness for large area display applications by a pulse reverse current electroforming process

With the increasing demand for large scale micro/nano components in the fields of display, energy and electrical devices, etc, the establishment of a roll imprinting process has become a priority. The fabrication of a roll stamp with high dimensional accuracy and uniformity is one of the key issues in the roll imprinting process, because the roll stamp determines the properties of the replicated micro/nano structures. In this study, a method to fabricate a metallic roll stamp with low internal stress, high flatness, and high hardness was proposed by a pulse reverse current (PRC) electroforming process. The effects of PRC electroforming processes on the internal stress, hardness, and grain size of the electroformed stamp were examined, and the optimum process conditions were suggested. As a practical example of the proposed method, various micro-patterns for electronic circuits were fabricated via the roll imprinting process using a PRC electroformed stamp.