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Performance Variation of Nano-Scaled Devices in 3D-IC Packaging Architecture Induced by TSV Residual Stress
Performance Variation of Nano-Scaled Devices in 3D-IC Packaging Architecture Induced by TSV Residual Stress
2019
Chang-Chun Lee
Pei-Chen Huang
Chi-Wei Wang
Keywords:
Optoelectronics
Residual stress
Nano-
Three-dimensional integrated circuit
Materials science
Composite material
Finite element method
Correction
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