Study on the optimization of parameters in ultrasonic vibration turning of single crystal silicon

The ultrasonic vibration cutting (UVC) method is an efficient cutting technique for the hard and brittle materials. The influence of ultrasonic vibration parameters on the critical cutting thickness (CCT) of single crystal silicon was investigated by spirally grooving experiment, and a series of experimental trials were carried out by using different cutting duty ratios (CDR). The results show that: the ultrasonic vibration efficiency is closely related to CDR, and increases with the decrease of CDR; when the ultrasonic vibration frequency and velocity were fixed, the CCT decreases as the vibration amplitude increases; the smaller the CDR is, the higher the surface finish of single crystal silicon machined by UVC will achieve. In the cutting tests, the experiment in which the value of CDR is 0.13, realized the ductile mode cutting for the Φ100mm specimen in the whole area.