Analysis of Microchannel Heat Dissipation Characteristics of LTCC Microwave Module

With the constant miniaturization of low temperature co-fired ceramic (LTCC) microwave module, its unit power has been increasingly higher, and good heat dissipation is the prerequisite for its normal operation. In this paper, the ANSYS finite element software was used to design the LTCC microwave module microchannel liquid cooling heat dissipation model, and the heat flux coupling analysis was performed for the model. The results showed that the microchannel and thermal column structure will affect the heat dissipation of LTCC microwave module. The comparative tests revealed that the main structural parameters of microchannel and thermal column structure in affecting the heat dissipation of LTCC microwave module include the diameter of thermal column, the number of thermal columns, and the height of runner section. According to the orthogonal test, the degree of influence of the diameter of thermal column, the number of thermal columns, and the height of runner section on heat dissipation of LTCC microwave module is as follows: the number of thermal columns > the diameter of thermal column > height of runner section.