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Young’s Modulus Evaluation of Electroplated Ti/Au Structures by Multi-layer Metal Technology (1)
Young’s Modulus Evaluation of Electroplated Ti/Au Structures by Multi-layer Metal Technology (1)
2017
Daisuke Yamane
Toshifumi Konishi
Teruaki Safu
Hideaki Nakajima
Minami Teranishi
Chun-Yi Chen
Tso-Fu Mark Chang
Masato Sone
Hiroshi Toshiyoshi
Kazuya Masu
Katsuyuki Machida
Keywords:
Electroplating
Microelectromechanical systems
Metal
Young's modulus
Composite material
Materials science
multi layer
Correction
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