Old Web
English
Sign In
Acemap
>
Paper
>
Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
2003
Patricia F. Mead
Aravind Ramamoorthy
Shapna Pal
Keywords:
Electronic circuit
Electronic engineering
Delamination
Leakage (electronics)
Engineering
Electrical engineering
Electronic packaging
Flip chip
Microwave
Correction
Source
Cite
Save
Machine Reading By IdeaReader
26
References
5
Citations
NaN
KQI
[]