Multi-line cutting type diamond linear cutting machine

The utility model relates to a linear cutting machine, in particular to a machine for cutting silicon crystals, while the provided linear cutting machine can effectively cut silicon crystal with high cutting efficiency. The multi line cutting type diamond linear cutting machine comprises a machine body provided with a worktable, a worktable driving mechanism and a control system and is characterized by further comprising diamond steel wires for cutting work piece, a guide wheel mechanism for positioning the motion of the diamond steel wires, a driving mechanism for driving the diamond steel wires, a wire storage mechanism for storing the diamond steel wires and a tension mechanism for holding the diamond steel wires in tension state. The machine body is provided with an upright rail on which the worktable is positioned in sliding type and is provided with a hydraulic mechanism for pushing the worktable upwards. The guide wheel mechanism comprises at least one couple of guide wheels at two sides of the worktable to form at least one diamond linear cutting path spanning the worktable.