Development of Ultra Thin package

ULTRA THIN PACKAGE(UTP) with 0.45mm thickness has been developed for thinner cellular and note personal computer. This thickness has been attained by using an ultra-thin die, carrier tape with automated bonding (TAB) interconnection technology and stiffener attachment onto the carrier tape. The die does not project from tape carrier because the die is thinner than a polyimide tape of 0. 075mm thickness. The stiffener attached to the polyimide tape keeps good coplanarity ofouter lead and makes it easy to soldered on the mother board by solder reflow process.