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Cu wire bonding: Reliability improvement for high temperature in plastic packages
Cu wire bonding: Reliability improvement for high temperature in plastic packages
2009
Passagrilli
Vitali
Tiziani
Azzopardi
Keywords:
Wire bonding
power integrated circuits
Intermetallic
Aluminium
Electrical resistance and conductance
plastic packaging
Reliability (semiconductor)
Composite material
lead bonding
Materials science
Correction
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