Old Web
English
Sign In
Acemap
>
Paper
>
Stress Analysis on Pseudo-SOC Integration : Reduction of Stress between Chip and Resin
Stress Analysis on Pseudo-SOC Integration : Reduction of Stress between Chip and Resin
2008
Yutaka Onozuka
Hiroshi Yamada
Atsuko Iida
Kazuhiko Itaya
Hideyuki Funaki
Keywords:
Chip
Materials science
Composite material
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]