Large-scale Integration of 2D Material Heterostructures by Adhesive Bonding

Arne Quellmalz,Xiaojing Wang,Stefan Wagner,Simon Sawallich,Max C. Lemme,Kristinn B. Gylfason,Niclas Roxhed,Göran Stemme,Frank Niklaus

Large-scale Integration of 2D Material Heterostructures by Adhesive Bonding

2020

Arne Quellmalz
Xiaojing Wang
Stefan Wagner
Simon Sawallich
Max C. Lemme
Kristinn B. Gylfason
Niclas Roxhed
Göran Stemme
Frank Niklaus

We report the integration of graphene/hexagonal boron nitride (hBN) heterostructure devices on large-areas by adhesive wafer bonding, a method suitable for industrial mass-production. In this new a ...

Keywords:

Graphene
Adhesive
Nanotechnology
Materials science
Adhesive bonding
Heterojunction
Analytical chemistry
Wafer bonding
hexagonal boron nitride
Polymer
Semiconductor device fabrication
Silicon

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