Method for producing heat-conductive sheet, heat-conductive sheet, and semiconductor device

A method for producing a heat-conducive sheet, comprising: a molded article production step of molding a heat-conductive resin composition comprising a binder resin and a heat-conductive filler into a desired shape and then curing the molded product to produce a molded article made from the heat-conductive resin composition; a molded article sheet production step of cutting the molded article into a sheet-like shape to produce a molded article sheet in which the heat-conducive filler is protruded on the surface of the sheet; and a pressing step of pressing the molded article sheet so that the surface of the molded article sheet is coated with an oozed component that is oozed from the molded article sheet in such a manner that the oozed component can follow the protruded shape formed by the protruded heat-conductive filler on the surface of the molded article sheet.