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0604 Low Cycle Fatigue Characteristics for Sn-Ag-Cu Lead Free Solder Materials at Elevated Temperature
0604 Low Cycle Fatigue Characteristics for Sn-Ag-Cu Lead Free Solder Materials at Elevated Temperature
2012
Kousaku Ohi
Takashi Kawakami
Takahiro Kinoshita
Syungo Satake
Tetsuya Kugimiya
Kenji Hirohata
Minoru Mukai
Toshiyuki Moribayashi
Keywords:
Soldering
Low-cycle fatigue
Metallurgy
Materials science
Correction
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