Influence of plastic assembly yield with molding technology

The molding technology in IC assembly is to protect the ICs avoiding the external damage and indirectly provide the heat dissipation. The molding pattern design, transfer-mold system, providing the drawing pipeline for liquid molding compound in molding is not only the technical index, but the key in the assembly throughput. Furthermore, the integrity of molding compound in plastic assembly is the main role of assembly quality. Analyzing these two factors impacting the assembly performance is the chief investigation in this work.