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3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology
3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology
2021
Zhe Wang
Yuki Susumago
Tomo Odashima
Noriyuki Takahashi
Hisashi Kino
Tetsu Tanaka
Takafumi Fukushima
Keywords:
Die (integrated circuit)
Wafer-level packaging
Fan-out
Materials science
Flexible display
Mechanical engineering
Correction
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