Manufacturing a device

The invention relates to a method for manufacturing a device. The method includes providing a first substrate (110) and forming a layer arrangement (120) on the first substrate (110), wherein the layer arrangement (120) comprises at least one device layer (123). The process further comprises a forming circuit structures in the device layer (123) and providing a second substrate (150, 151). there is further provided a connecting between the second substrate (150, 151) and the device layer (123), and performing an etching process for separating at least a portion of the first substrate (110).