Reliability evaluation of glass interposer module

In this paper, we investigate reliability testing for a glass interposer. The test vehicle is an assembled glass interposer with a chip, a BT substrate. The structure of a glass interposer with two redistribution layers (RDLs) on the front-side and one RDL on the back-side has been evaluated and developed. Key technologies, including via fabrication, front-side RDL formation, microbumping, temporary bonding, glass thinning, and back-side RDL formation, have been developed and integrated for high performance. The BT substrate design and PCB for electrical characterization of reliability tests are reported in this paper. The results indicate that this glass interposer can be integrated. The data show the feasibility of this glass interposer for electronics applications.