Fully-crimping type IGBT chip positioning device body

The invention, which belongs to the field of the chip mounting technology, particularly relates to a fully-crimping type IGBT chip positioning device body. The fully-crimping type IGBT chip positioning device body is formed by buckling of two parts including a fixed upper die and a fixed lower die, wherein the two dies are arranged in an upper-lower mode; and the fixed upper die and the fixed lower die have the identical appearances and shapes. Six buckling teeth are processed at the fixed lower die; and the middle part of the fixed lower die has a hollow-out structure and is processed to form a plurality of chip fixed holes. Six buckling slots are formed in the fixed upper die by processing, wherein the distribution angles of the buckling slots match those of the buckling teeth of the fixed lower die; and a plurality of chip fixed holes identical with those of the fixed lower die are formed in the fixed upper die by processing. According to the invention, on the basis of buckling of the fixed upper die and the fixed lower die, IBGT chips are placed in the chip fixed holes, thereby effectively preventing phenomena of loosening and shedding and avoiding eccentricity and displacement of the IBGT chips. Moreover, the fully-crimping type IGBT chip positioning device body is an ideal one having advantages of simple structure, low cost, high temperature resistance, and low expansion factor after heating.