Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

A new process of embedding power die on PCB is presented which consists on removing wire bonding and solder and using only a pressed metal foam to connect the top and bottom sides of the die. First, the manufacturing process is described. Then the effective electrical, thermal and mechanical properties of the mixture made of the foam impregnated by resin insuring the contacts between die and PCB are identified experimentally and numerically. Finally, 3D FEM simulations are performed to estimate the electrical contacts resistances between foam and pads of the die within the package.