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Investigation of the Mechanism of Cu Eruption- Induced Copper Void Defects in Memory Applications.
Investigation of the Mechanism of Cu Eruption- Induced Copper Void Defects in Memory Applications.
2012
Kyung-min Chung
Jeong-Min Park
Tae-Eung Yoon
Gyuhwan Oh
Doo-Hwan Park
Se-Phyo Kim
Dong-Hyun Im
Dongbok Lee
Jun-Kyum Kim
Mi-Lim Park
Dong Hyun Kim
Youngsu Chung
Jongmin Baek
Sung-Un Kwon
Hoon Jeong
Joon Kim
Seok-Woo Nam
Ho-Kyu Kang
Chilhee Chung
Keywords:
Copper
Materials science
Metallurgy
Void (astronomy)
Correction
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