QFN package and high speed IC collaborative design signal integrity analysis method

The invention discloses a QFN package and high speed IC collaborative design signal integrity analysis method. A high speed IC signal integrity test circuit is arranged in a chip with the QFN package, so that the high speed IC signal integrity can be analyzed. The method is high in generality, small in area, the high speed signal can be analyzed, and the signal integrity analysis accuracy is improved. The circuit includes a frequency reduction circuit and an end connection circuit. The method is characterized in that the high speed IC signal integrity test circuit arranged in the chip is high in integrity level, area is small, and the high speed IC signal can be tested.