A process for producing optoelectronic devices for encapsulation of layers

There is provided a method for producing optoelectronic components for the encapsulation of layers. For this purpose a support (1) having a support main side (10) is provided. To the carrier main side (10) of the carrier (1) is applied a mask (2). The mask (2) has a first mask layer (21) and a second mask layer (22). Further, the mask (2) on at least one aperture (200) which completely penetrates the mask (2) in the direction perpendicular to the carrier main side (10). Furthermore, the first mask layer (21) in the region of the opening (200) at least an undercut (201) with respect to the second mask layer (22). After application of the mask (2) on the support (1) a functional material (4) is deposited so arranged in the region of the opening (200) at least one on the carrier main side (10) the material structure (41) is formed. Subsequently, a capsule layer (5) on at least the material structure (41) is deposited. The capsule layer (5) is deposited such that prior to applying the capsule layer (5) exposed sides of the material structure (41) completely with the capsule layer (5) are covered. In a further step, the mask (2) after application of the encapsulating layer (5) is removed.