Осаждение из растворов многослойных пленок металлов на кремний

Method of multilayer metal and alloy plating on the surface of polished silicon plates with the film thickness up to 5―9 μm has been developed. The necessity to create functional silanol groups and to preserve them at all stages of silicon treatment has been shown on purpose to pro-vide adhesion interaction in the silicon―metal system. Hypophosphite plating solution with pH 6.2 and an additive diminishing internal stress that provides deposition of Ni―P thin films with the grain size ~0,1 μm and high adhesion to the polished silicon has been suggested. This adhe-sion is enough to ensure the following Ni, Pd, Pd―Ni, Au, Cu―Sn plating. It has been found out that during metal film growth, their storage and thermal treatment (280 оС) the formation of transitive zones occurs which contain atoms of the elements from the silicon substrate and from the deposited films. The thickness of these zones is about 1―3 μm.