Fabrication of Capacitive Micromachined Ultrasonic Transducer Arrays With Isolation Trenches Using Anodic Wafer Bonding
2015
This paper presents a novel process for the fabrication of capacitive micromachined ultrasonic transducer (CMUT) arrays with isolation trenches using anodic bonding technique. The developed fabrication process is easy, stiction-free, repeatable, reliable, requires low-temperature ( $1 \times 5, 5 \times 5$ , and $10 \times 10$ CMUT arrays. CMUT cells were designed using MEMSCAD tool CoventorWare. The fabricated devices have been characterized using nanovibration analyzer, and the resonance frequency is found to be $\sim 1.5$ MHz.
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