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212 電子デバイスの高温熱変形評価(OS6-3 光学的手法II)(OS6 実験力学の新展開)
212 電子デバイスの高温熱変形評価(OS6-3 光学的手法II)(OS6 実験力学の新展開)
2001
yasuyuki morita
kazuo sinkawa
mitugu higasi fuzi
youiti ueno
kiyosi takahasi
masayuki kaneto
Keywords:
Composite material
Flip chip
Materials science
moire interferometry
thermal deformation
Correction
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