Thermo-physical properties of boron carbide reinforced copper composites fabricated by electroless deposition process

Abstract B 4 C/Cu composites with enhanced thermal–physical properties were prepared by spark plasma sintering (SPS) after the pretreatment of electroless deposition of copper on the boron carbide particles surface. The boron carbide particles underwent acid treatment, salt-based colloid palladium activation process, and electroless copper deposition on their surface respectively. Samples were analyzed by X-ray diffraction, scanning electron microscopy, and energy dispersive spectrometer in terms of microstructure and chemical composition. The microstructure investigated by SEM shows that high quality copper deposits are obtained on the B 4 C particles surface accompanied by the good interfacial contact between the copper and the pretreated B 4 C powder in the sintered sample. It was found that the thermal conductivity decreased as B 4 C volume fraction increased in copper matrix, while the coefficient of thermal expansion increased.