Heat Transfer Performance of Loop Thermosyphon using Enhanced Boiling and Condensation Surfaces

We have developed a loop thermosyphon to provide high cooling performance for cooling electronic devices.  The loop thermosyphon used a porous structure on a boiling surface and a microgroove structure on a condensation surface.  In this study, we measured the heat transfer performance and we obtained the following results.  The evaporation heat transfer of the porous structure is about six times as large as that of the flat surface.  The total thermal resistance of the thermosyphon using a porous structure on the boiling surface and a microgroove structure on the condensation surface is about half of that using flat surfaces.