A kind of high reliability copper alloy bonding wire used for electronic packaging and preparation method thereof

The invention discloses a kind of high reliability copper alloy bonding wire used for electronic packaging and preparation method thereof, the material composition percentage by weight composition of the bonding wire is：Copper content is 99.75%-99.96%, W content 0.01-0.1%, silver content 0.01%-0.03%, scandium content are 0.01%-0.02%, Ti content 0.001%-0.03%, chromium content 0.001%-0.03%, iron content 0.001%-0.02%.Its preparation method includes：DNA purity is more than 99.99% high purity copper, is prepared into copper alloy casting ingot, then as cast condition copper alloy bus is made, and bus is drawn into copper alloy silk after heat treatment, then the copper alloy bonding wire of different size is made after accurate drawing, heat treatment, cleaning.The copper alloy bonding wire of the present invention has strong inoxidizability, excellent corrosion resistance, bond strength height, ductility is good, conductive and thermal conductivity is good, high reliability.