Insights into the System-Level IEC ESD Failure in High Voltage DeNMOS-SCR for Automotive Applications

A unique failure mechanism for IEC stress through a common-mode choke is investigated. Minor variations in the stress current waveform shape for specific IEC stress levels are found to cause an unexpected window failure. 3D TCAD simulations are used to understand the device behavior and failure under the peculiar two-pulse shaped IEC current waveform. Device sensitivity to different components in the stimulus is studied in detail.